Q3 NAND Flash average contract prices are expected to rise 5%-10% QoQ.

1. TrendForce: Q3 NAND Flash Average Contract Price Expected to Rise 5%-10% QoQ

According to Cailian Press, the latest survey from TrendForce shows that after production cuts and inventory reduction in the first half of 2025, the supply-demand imbalance in the NAND Flash market has significantly improved. As manufacturers shift capacity to higher-margin products, the available supply in the market has tightened.

On the demand side, increased corporate investment in AI and the mass shipment of NVIDIA’s next-generation Blackwell chips provide support. Looking ahead to Q3 NAND Flash pricing, the average contract price is expected to increase by 5% to 10% quarter-on-quarter. However, eMMC and UFS products will see smaller price hikes due to uncertain smartphone demand in the second half of the year.

2. LPDDR6 Memory Standard Officially Released: Speeds Up to 14.4GHz

According to Fast Technology, JEDEC has officially released the LPDDR6 memory standard (specification number JESD209-6), significantly improving performance, energy efficiency, and security for mobile devices and AI applications.

In terms of performance, LPDDR6 adopts a dual-channel architecture, maintaining a minimum access granularity of 32 bytes while allowing more flexible operations. However, JEDEC has not specified the data transfer rate (frequency) for LPDDR6. Previous reports suggest a starting speed exceeding 10Gbps (10,667 Mbps), with a maximum of 14,400 Mbps (14.4 GHz).

By comparison, LPDDR5 starts at 6,400 Mbps, LPDDR5X reaches 8,533 Mbps, and SK Hynix’s customized LPDDR5T achieves 9,600 Mbps.

3. Kioxia Samples UFS 4.1 Flash Memory with Up to 1TB Capacity

Japanese flash memory giant Kioxia recently announced that it has begun sampling its new UFS 4.1 embedded flash memory devices, designed to meet the demands of next-gen mobile applications, such as advanced smartphones with on-device AI.

Kioxia’s UFS 4.1 devices incorporate innovative BiCS FLASH 3D NAND and a controller integrated into a JEDEC-standard package. The new product uses 8th-generation BiCS FLASH 3D NAND with CMOS-under-array (CUA) technology, significantly improving energy efficiency, performance, and density. Kioxia’s UFS 4.1 devices balance speed and low power consumption, enabling faster downloads and smoother app performance.

4. NXP Releases BMx7318/7518 Series Battery Control ICs

NXP has launched the BMx7318/7518 family, an 18-channel lithium-ion battery cell controller for high-voltage battery management systems in EVs, industrial energy storage systems, and 48V battery management systems.

Based on NXP’s new advanced architecture, the product features a dedicated ADC per channel, offering flexible variants with pin-to-pin compatibility, providing cost-effective solutions while enhancing overall BMS performance. The new IC meets automotive ASIL-C and industrial SIL-2 functional safety certifications. The BMx7318/7518 series is expected to hit the market in November 2025.

5. SmartSens Introduces 3MP Automotive-Grade CMOS Image Sensor SC326AT

Recently, SmartSens launched the SC326AT, an upgraded 3MP automotive-grade image sensor from its Automotive Sensor (AT) Series.

As the first fully domestically produced CMOS image sensor in SmartSens’ automotive lineup, the SC326AT is built on the company’s CarSens-XR process technology. It features a 3.0µm pixel size and backside-illuminated (BSI) design, significantly improving sensitivity, noise suppression, high-temperature imaging stability, and power efficiency.

The SC326AT complies with ISO 26262 ASIL-B functional safety and ISO 21434 cybersecurity standards, offering high reliability and security to support the evolution of smart automotive applications. Samples are now available, with mass production expected in Q4 2025.

6. Murata Begins Mass Production of World’s First 0402-inch 47µF MLCC

Murata Manufacturing recently announced the mass production of the industry’s first 0402-inch (1.0x0.5mm) multilayer ceramic capacitor (MLCC) with a capacitance of 47µF.

With the rapid deployment of AI servers and other devices, there is a growing need for efficient component placement on limited circuit boards. To meet these demands, Murata has developed proprietary ceramic dielectric and ultra-thin internal electrode layering technologies, enabling the mass production of this breakthrough MLCC.

Compared to Murata’s previous 47µF product (0603-inch size), this new MLCC reduces mounting area by ~60%. Against Murata’s previous 0402-inch 22µF MLCC, the new product offers ~2.1x higher capacitance. Moreover, its ability to operate in high-temperature environments (up to 105°C) allows placement near chips, enhancing the performance of end products and equipment.